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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
ROUND TYPE LED LAMPS
Pb
Lead-Free Parts
LHR2640/P1/TRS-X
DATA SHEET
DOC. NO : REV. DATE : :
QW0905- LHR2640/P1/TRS-X A 22 - Jul. - 2008
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHR2640/P1/TRS-X Page 1/6
Package Dimensions
H
P2
H2 H1 L W2 W0
W1
W3
P1 D P
F
-+
T
LHR2640/P1-PF
2.9
3.1
3.3
4.3 10.050.5
1.5MAX 25.0MIN
0.5 TYP
1.0MIN 2.54TYP + Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHR2640/P1/TRS-X
Page 2/6
Absolute Maximum Ratings at Ta=25
Ratings
Parameter
Symbol
HR
UNIT
Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature Soldering Temperature
IF IFP PD Ir Topr Tstg Tsol
30 100 100 10 -40 ~ +85 -40 ~ +100 Max 260 for 5 sec Max
mA mA mW
A
Typical Electrical & Optical Characteristics (Ta=25 )
COLOR PART NO MATERIAL Emitted LHR2640/P1/TRS-X GaAlAs Red Lens Red Diffused
Peak wave length
Spectral halfwidth
nm
Forward voltage @20mA(V) Min. Max. 2.4
Luminous intensity @20mA(mcd)
Pnm
Min. 65 Typ. 120
Viewing angle 21/2 (deg)
660
20
1.5
50
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHR2640/P1/TRS-X *Dimensions Symbol Information SPECIFICATIONS SYMBOL ITEMS OPTION SYMBOL CODE
-------------------
Page 3/6
Minimum mm inch
0.15 0.09
-------
Maximum mm
4.2 3.0 2.0 18.5 22.5 26.5 28.5 23.5 20.9 25.0 25.5 20.0 19.4 36 11.0
inch
0.17 0.12 0.08 0.73 0.89 1.04 1.12 0.93 0.82 0.98 1.0 0.79 0.76 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75
Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection
D F
H
3.8 2.3
-------
Feed Hole To Bottom Of Component
TRS-1 TRS-2 TRS-3 TRS-4 TRS-5 TRS-6 TRS-7 TRS-8 TRS-9 TRS-10
-------------------------------------------------------------
H1
17.5 21.5 25.5 27.5 22.5 19.9 24.0 24.5 19.0 18.4
-------
0.69 0.85 1.0 1.08 0.89 0.78 0.94 0.96 0.75 0.72
-------
Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width
H2 L P P1 P2 T W0 W1 W2 W3
W0 12.4 4.4 5.1
-------
0.49 0.17 0.2
-------
13.0 5.8 7.7 1.42 9.75 15.5 4.0 19.0
8.5 14.5 0 17.5
0.33 0.57 0 0.69
REMARK:TRS=Tape And Reel Straight Leads
* Dimensions Symbol Information
Specification Description Symbol minimum mm
Reel Diameter Core Diameter Hub Recess Inside Diameter Arbor Hole Diameter Overall Reel Thickness Iside Reel Flange Thickness
* Package Dimensions
maxmum D3 mm 380 102 88.0 38.1 57.2 inch 14.96 4.02 3.46 1.5 2.25 1.97 T1 T2 D MARKING D2 D1
inch 3.08 1.37 1.13 0.54
D D1 D2 D3 T2 T1
78.2 34.9 28.6 13.8
30.0
1.18 500PCS
50.0
Quantity/Reel
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHR2640/P1/TRS-X Page4/6
Typical Electro-Optical Characteristics Curve
HR CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
Relative Intensity@20mA
1.0 2.0 3.0 4.0 5.0
1000
3.0 2.5 2.0 1.5 1.0 0.5 0 1.0 10 100 1000
Forward Current(mA)
100 10
1.0 0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Forward Voltage@20mA
Relative Intensity@20mA
-40 -20 -0 20 40 60 80 100
1.2
3.0 2.5 2.0 1.5 1.0 0.5 0 -40
1.1
1.0
0.9 0.8
-20
-0
20
40
60
80
100
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
Directivity Radiation
0 -30 30
Relative Intensity@20mA
1.0
0.5
-60
60
0 600 650 700 750
100% 75% 50%
25%
0
25%
50% 75% 100%
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHR2640/P1/TRS-X Page 5/6
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile Dip Soldering Preheat: 120C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)
Temp( C) 260 C3sec Max
260
5 /sec max
120
2 /sec max
25 0
0
Preheat 60 Seconds Max
50
100
150
Time(sec)
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHR2640/P1/TRS-X Page 6/6
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 5 2.RH=90 %~95 % 3.t=240hrs 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 5 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 5 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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